MUMBAI, India, May 29 -- Intellectual Property India has published a patent application (202641064479 A) filed by Jeba. P. S; G. Brenda; Anbu Shamini G N; Juliet Rose D. B; V. Jesline Jeme; Priya J. S; Sindhuja S N; and Femina Jalin. A, Kanyakumari, Tamil Nadu, on May 21, for 'smart signal processing unit casing with integrated thermal vent channel design.'
Inventor(s) include Jeba. P. S; G. Brenda; Anbu Shamini G N; Juliet Rose D. B; V. Jesline Jeme; Priya J. S.; Sindhuja S N; and Femina Jalin. A.
The application for the patent was published on May 29, under issue no. 22/2026.
According to the abstract released by the Intellectual Property India: "The invention discloses a smart signal processing unit casing with an integrated thermal vent channel design for improved heat management. The casing incorporates internal airflow pathways that efficiently dissipate heat generated by electronic components. Designed using fluid dynamics principles, the channels ensure uniform airflow distribution and reduce thermal hotspots. The structure eliminates the need for external cooling systems, thereby reducing power consumption and system complexity. Constructed from thermally conductive materials, the casing enhances heat transfer while maintaining durability and compactness. The design supports modular configurations, making it adaptable for various applications. This innovation significantly improves performance, reliability, and lifespan of signal processing units in modern electronic systems."
Disclaimer: Curated by HT Syndication.
