MUMBAI, India, Feb. 13 -- Intellectual Property India has published a patent application (202641007578 A) filed by Cvr College Of Engineering, Hyderabad, Telangana, on Jan. 27, for 'smart package with event-based tampering signature and verification.'
Inventor(s) include P. Vasantha Lakshmi; S. Vineela Krishna; and Avula Chitty.
The application for the patent was published on Feb. 13, under issue no. 07/2026.
According to the abstract released by the Intellectual Property India: "Smart packaging systems that can identify, categorize and establish a history of tampering events are revealed. The system includes a package enclosure coupled with one or more sensors designed to measure physical contact with the package such as forces to open the package, deformation modes, and punctures or seal breaks. A control unit processes sensor data in order to identify a tampering signature, which is the format, order, and strength of the interaction. The signature of the tampering is saved in a memory element, and it can be transmitted to another device to verify the signature. In contrast to traditional tamper-evident package design, which only provides information as to whether a package was opened or not, the disclosed system provides information on how its package was accessed and whether the access was in line with the accepted practices of opening packages."
Disclaimer: Curated by HT Syndication.
