MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517045075 A) filed by Logisteed Ltd., Tokyo, on May 9, for 'slope and method for utilizing same.'
Inventor(s) include Kanai Shunsuke; and Shirai Katsuya.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "Provided is a slope which is used for movement of a heavy object and which can be produced with low environmental load and at low cost.???The slope comprises: a frame body which is made of corrugated cardboard which includes a bottom plate part extending in a first direction and a pair of side wall parts extending in the first direction connected to the bottom plate part facing each other and having a height that gradually decreases in the first direction and a cross section of which orthogonal to the first direction indicates a channel shape; and a reinforcing member formed by filling an internal space surrounded by the frame body with a plurality of planer members made of corrugated cardboard and layered without being bonded to each other. The plurality of planer members fill the frame body in such an orientation that the corrugated flute direction of the core of the planer members is substantially parallel with the surface of the side wall parts."
The patent application was internationally filed on Dec. 23, 2022, under International application No.PCT/JP2022/047673.
Disclaimer: Curated by HT Syndication.
