MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517072423 A) filed by Daikin Industries, Ltd., Osaka, Japan, on July 30, for 'shell-and-plate type heat exchanger and refrigeration device.'
Inventor(s) include Utsumi Daichi; Yamaguchi Masaki; Numata Mitsuharu; and Ichimura Shuhei.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "A partition member (5) is disposed between a plate laminate (30) and a refrigerant inlet (21). The partition member (5) extends in a first direction which is the lamination direction of the plate laminate (30). The partition member (5) has a plurality of communication holes (50). The communication holes (50) open toward the plate laminate (30) at positions facing a center heat exchange part (35), a first heat exchange part (36), and a second heat exchange part (37)."
The patent application was internationally filed on Mar. 25, 2024, under International application No.PCT/JP2024/011788.
Disclaimer: Curated by HT Syndication.