MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202544082221 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on Aug. 29, 2025, for 'semiconductor package.'
Inventor(s) include Junghoon Kang.
The application for the patent was published on April 10, under issue no. 15/2026.
According to the abstract released by the Intellectual Property India: "A semiconductor package includes a substrate, a logic die on the substrate, a base insulating layer on side surfaces and an upper surface of the logic die, an insulating layer through via extending through the base insulating layer at a side of the logic die, a high bandwidth memory on an upper surface of the base insulating layer, at least one optical structure on the upper surface of the base insulating layer, and at least one optical connector including an optical fiber configured to transmit an optical signal between the at least one optical structure and an external device, where the high bandwidth memory includes a plurality of memory dies stacked in a first direction that perpendicular to the upper surface of the base insulating layer and the at least one optical structure is connected to the logic die in the first direction."
Disclaimer: Curated by HT Syndication.
