MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202411004726 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Jan. 23, 2024, for 'secured package sealing device.'
Inventor(s) include Navjeet Kaur.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A secured package sealing device includes an elongated bifurcated body 1 having a proximal and distal portion 2, 3, two plates 4 attached at distal portion 3 each via a links 5 pivoted across distal portion 3, proximal portion 2 is griped by user for positioning plates 4 over mouth portion of package to be sealed, an imaging unit 6 installed on distal portion 3 determines package's size and stored commodity, accordingly microcontroller evaluates volume of nitrogen gas to be filled within package, a cylinder 7 integrated with a conduit 8 is positioned by user within package, an nozzle 9 integrated on conduit 8 for filling evaluated volume of gas within package, user applies force on body 1 which is transmitted on plates 4, a piston integrated amid links 5 amplifies applied force to clip mouth portion, a heating element 11 integrated on plates 4 seals mouth portion."
Disclaimer: Curated by HT Syndication.
