MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202541134193 A) filed by National Institute Of Technology, Calicut, Kerala, on Dec. 31, 2025, for 'sandwich strategy for surface modification using wire arc additive technology.'
Inventor(s) include Prakash R. S; and Jinu Paul.
The application for the patent was published on Jan. 9, under issue no. 02/2026.
According to the abstract released by the Intellectual Property India: "A method for surface modification of a metallic substrate using a binder-free sandwich strategy with wire arc additive technology, comprising the steps of: a. cleaning a surface of the metallic substrate designated for modification; b. distributing a uniform layer of dry alloying element powder directly over the cleaned surface; c. positioning a thin cover plate, having a chemical composition substantially similar to the metallic substrate, over the layer of alloying element powder; d. clamping the cover plate to the metallic substrate to form a secured assembly; e. performing single-layer wire arc melting on the secured assembly using selected welding parameters to achieve penetration through the cover plate, incorporation of the alloying element powder, and fusion with the metallic substrate, thereby forming an alloyed surface layer; f. allowing the assembly to cool to ambient temperature; and g. post-machining the alloyed surface layer to achieve a smooth finish."
Disclaimer: Curated by HT Syndication.
