Intellectual Property India Publishes Patent Application for 'Robust Retransmissions At Medium Access Control Layer For Ultra High Reliability' Filed by Samsung Electronics Co. Ltd.

MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202441035203 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on May 3, 2024, for '"robust retransmissions at medium access control layer for ultra high reliability".'

Inventor(s) include Abhishek Chaturvedi; Karthik Srinivasa Gopalan; and Manasi Ekkundi.

The application for the patent was published on Nov. 7, under issue no. 45/2025.

According to the abstract released by the Intellectual Property India: "Embodiments herein relates to a method and AP MLD for robust retransmissions at MAC layer for ultra-high reliability. The method include transmitting UHR multi-link capability information element to non-AP MLD (301) indicating support for cross-link retransmission. Further, method includes mapping TID to all supported links for retransmissions within the AP MLD. The TTLM is applicable for both the intra-AP MLD and the inter-AP MLD scenarios. Further, the method includes transmitting the control information to the non-AP MLD to facilitate the cross-link retransmission. The control information includes all the supported links for retransmissions."

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