MUMBAI, India, Nov. 21 -- Intellectual Property India has published a patent application (202517099016 A) filed by Toyobo MC Corporation, Osaka, Japan, on Oct. 14, for 'resin composition, water-based resin composition, water-based adhesive, and laminate.'
Inventor(s) include Fujimoto, Motoki; and Kashihara, Kenji.
The application for the patent was published on Nov. 21, under issue no. 47/2025.
According to the abstract released by the Intellectual Property India: "The present invention provides a resin composition having high adhesive strength at room temperature and sufficient adhesive strength even at high temperature. Specifically, the present invention provides a resin composition containing an acid-modified polyolefin resin (A) and a polyurethane resin (B). The content of the polyurethane resin (B) is 20-100 mass parts inclusive per 100 mass parts of the acid-modified polyolefin resin (A), and the acid-modified polyolefin resin (A) contains an acid-modified polyolefin resin (a) having a melting point of 90 C or higher and an acid-modified polyolefin resin (b) having a melting point of less than 90 C."
The patent application was internationally filed on Mar. 19, 2024, under International application No.PCT/JP2024/010864.
Disclaimer: Curated by HT Syndication.
