MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517051278 A) filed by Prime Polymer Co. Ltd., Tokyo, on May 28, for 'resin composition, multilayer body and packaging material.'
Inventor(s) include Fujii Sumiaki; Saito Tetsuya; Oguni Michihiko; Yoshidome Ken; and Suzuki Masao.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "[Problem] To provide a resin composition which is capable of constituting a multilayer body that has excellent extrusion lamination processability, heat resistance and flexibility, and the like. [Solution] A resin composition which contains the four components described below at a specific content ratio. (A) A propylene polymer that satisfies the following requirements: (A-1) the MFR is 0.1 to 60 g/10 minutes; (A-2) the density is 886 to 930 kg/m3; and (A-3) the melting point is 130 to 170 C. (B) A propylene polymer that satisfies the following requirements: (B-1) the MFR is 0.1 to 60 g/10 minutes; (B-2) the density is 855 to 885 kg/m3; (B-3) the melting point is 130 to 170 C; and (B-4) the Shore A hardness is 65 to 90. (C) An ethylene polymer that satisfies the following requirements: (C-1) the MFR is 0.2 to 10 g/10 minutes; (C-2) the density is 855 to 913 kg/m3; and (C-3) the melting point is less than 130 C. (D) A low-density polyethylene that satisfies the following requirements: (D-1) the MFR is 0.1 to 50 g/10 minutes; and (D-2) the density is 914 to 935 kg/m3."
The patent application was internationally filed on Nov. 21, 2023, under International application No.PCT/JP2023/041769.
Disclaimer: Curated by HT Syndication.
