MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517092021 A) filed by Deutsche Institute Fur Textil- Und Faserforschung Denkendorf, Denkendorf, Germany, on Sept. 25, for 'radiative cooling structure having a textile carrier substrate, a method for producing the radiative cooling structure and use thereof.'
Inventor(s) include Zimmermann, Lea; Stegmaier, Thomas; and Kaya, Cigdem.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a radiative cooling structure having at least one radiative functional layer on a textile carrier substrate. The radiative cooling structure is characterised in that a radiative functional layer (A), made of a plastic matrix based on a crosslinked silicone rubber, is formed on the textile carrier substrate, wherein aluminium particles are embedded in the radiative functional layer (A) and a radiative functional layer (B), made of a plastic matrix which is also based on a crosslinked silicone rubber, is located on the radiative functional layer (A), wherein white pigments are embedded in the radiative functional layer (B). The textile carrier substrate is preferably a flat textile. The radiative cooling structure provides excellent reflectance and emission values and thus advantageous cooling capacities, this being independent of the substrate. The invention also relates to an advantageous method for producing the radiative cooling structure and to a use of the radiative cooling structure outdoors."
The patent application was internationally filed on Mar. 22, 2024, under International application No.PCT/EP2024/057827.
Disclaimer: Curated by HT Syndication.
