MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202441075311 A) filed by Apexcognita Private Limited, Hyderabad, Telangana, on Oct. 4, 2024, for 'quantum-resistant universal e-signature integration module with blockchain-based verification and ai-driven multi-jurisdictional compliance.'
Inventor(s) include Babu Siva Prasad Dachepalli.
The application for the patent was published on April 10, under issue no. 15/2026.
According to the abstract released by the Intellectual Property India: "The Universal e-Signature Integration Module (100) is an advanced system for creating, verifying, and managing electronic signatures across various platforms and jurisdictions. It employs quantum-resistant cryptography (101) for long-term security, a blockchain-based ledger (103) for immutable record-keeping, and an AI-driven multi-jurisdictional compliance engine (105) to ensure global legal validity. The system features advanced biometric authentication (107), smart contract integration (111), and AI-powered fraud detection (113). It is designed to meet diverse regulatory requirements while providing a seamless, secure e-signature experience for users across different sectors and geographical boundaries. The system's scalable architecture enables it to handle high volumes of signatures, making it suitable for enterprises of all sizes and global operations. The system incorporates a flexible signature algorithm framework (109), dynamic legal compliance monitoring, and extensible biometric integration, alongside blockchain portability and quantum-resistant signature capabilities, ensuring long-term validity and legal compliance of electronic signatures across jurisdictions. 12. DESCRIPTION OF THE DRAWINGS Fig. 1: Overall System Architecture of the Universal e-Signature Integration Module Fig. 2: Quantum-Resistant Digital Signature Process Fig. 3: Blockchain-Based Signature Ledger Structure Fig. 4: AI-Driven Multi-Jurisdictional Compliance Engine Fig. 5: Advanced Biometric Authentication System Fig. 6: Cross-Platform Integration Framework Fig. 7: Smart Contract Integration and Execution Process Fig. 8: AI-Powered Fraud Detection System Fig. 9: Scalable Signature Processing Engine Architecture Fig. 10: Quantum Resilience Strategy Implementation Fig. 11: Multi-Jurisdictional Compliance Workflow Fig. 12: Biometric Data Flow and Security Measures Fig. 13: Smart Contract Lifecycle within the E-Signature Ecosystem Fig. 14: Cross-Chain Interoperability for Smart Contracts Fig. 15: Scalability Scenarios Comparison 13."
Disclaimer: Curated by HT Syndication.
