MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202541116115 A) filed by Psg College Of Arts And Science; and Psg College Of Technology And Applied Research, Coimbatore, Tamil Nadu, on Nov. 24, 2025, for 'production of thermally stable di-imidazole cored epoxy composites.'
Inventor(s) include P. Pavithra; S. Devaraju; R. Venkateswaran; and M. Alagar.
The application for the patent was published on Jan. 23, under issue no. 04/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to the production of new type of di-imidazole cored bisphenol-based epoxy resin (DIBP-EP) and its characterization. The DIBP-EP matrices and composites are cured with varied nature of curatives 10 and studied for their thermal stability, percentage char yield, flame resistance, water contact angle, coefficient of thermal expansion, percentage moisture absorption and storage life to ascertain their suitability for thermal and flameresistant applications. The experimental value of molecular mass ofDIBP- EP resin of811.49 m/z, coincides with the value calculated based on its molecular 15 structure. The epoxy equivalent of DIBP-EP was found to be. 405. The curing temperature of DIBP- EP obtained with varied nature of curatives are ranged between 95 C and 175 C. Among them, ATDT as curative for DIBP-EP system exhibited the lowest curing temperature of 95 C. The glass transition temperature (Tg) values obtained tor DlBP-EP matrices obtained with DDM 20 as curative is 167 C. The decomposition temperature (Td) obtained tor DIBPEP matrices with varied nature of curatives are ranged between 258 C and 331 C. Among them DAAQ cured DIBP-EP system exhibited the highest decomposition temperature of 331 C. The DIBP- EP matrices possess the flame-retardant behavior of YO rating and their values of LOI calculated are 25 ranged between 29.7% and 36.5%. The values coefficient of thermal expansion of DIBP-EP matrices cured with DDM and reinforced with LSM and ZrW20s are ranged between 41.75 xI Q-6/oc and 56.75 xI Q-6/oc. The values of water. contact angle of DIBP-EP matrices obtained are ranged between 85 and 120 and the values of moisture absorption of DfBP- EP 30 matrices are ranged between 0.05 %and 0.35 %. The storage stability (shelflife) ofDIBP- EP resin mixed with varied nature of curatives is stable beyond 5 months at 30 C. The present invention is considered as cutting-edge concept in the field of low temperature latent cure epoxy technology for the fabrication of advanced composites."
Disclaimer: Curated by HT Syndication.
