MUMBAI, India, Feb. 13 -- Intellectual Property India has published a patent application (202541123935 A) filed by Psg Institute Of Technology And Applied Research, Coimbatore, Tamil Nadu, on Dec. 9, 2025, for 'production of chalcone based bifunctional cyanate ester derivatives.'
Inventor(s) include Dr. S. Devaraju; Dr. M. Selvi; and Dr. M. Alagar.
The application for the patent was published on Feb. 13, under issue no. 07/2026.
According to the abstract released by the Intellectual Property India: "The present invention deals with the production of di-imidazole cored bisphenol (DIBP) and its conversion in to varied nature of benzoxazines (DIBP-Bz). The DIBP-Bz developed are blended both with fossil-based epoxy 10 (Bisphenol-F-Epoxy-BFE) resin and bio-based epoxy (Cardanol-Bisphenol Epoxy-CBE) resin in the equimolar ratio of 1:1 to obtain hybrid benzoxazineepoxy matrices suitable for high performance thermally stable dielectric applications. The curing temperatures obtained for DIBP-Bz in the absence of catalysts are ranged between 211 C and 230 C and in the presence of catalysts 15 (3,3-Thiodipropionic acid and Gallic acid) are ranged between 191C and 213 C. Among them, the DIBP-la possesses the lowest the curing temperature of 211 C in the absence of catalyst and DIBP-sa possesses the lowest the curing temperature of 191 C in the presence of catalyst. The curing temperatures of DIBP-Bz-BFE and DIBP-Bz-CBE matrices are ranged 20 between 144 C and 206 C. Among them DIBP-la-BZ/BFE hybrid system exhibited the lowest curing temperature of 144 C. The initial decomposition temperatures of DIBP-Bz-BFE and DIBP-Bz-CBE matrices are ranged between 351 C and 367 C, and 300 C and 339 C respectively. The percentage char yield obtained for DIBP-Bz-BFE and DIBP-Bz-CBE matrices are ranged 25 between 36.9 % and 61.1 %, and 17.5 % and 37.0 % respectively. The value of LOI of DIBP-Bz-BFE and DIBP-Bz-CBE matrices calculated from thermpgravimetric analysis are ranged between 32.3% and 41.9 %, and 24.5% and 32.3 % respectively. The values of dielectric constant of DIBP-Bz-BFE and DIBP-Bz-CBE matrices obtained are ranged between 2.9 and 3.4. Among 30 them, the DIBP-sa/CBE hybrid blend possesses the lowest value of 2.9. Similarly, the values of dielectric loss obtained are ranged between 0.05 and 0.08. The values of water contact angle of DIBP-Bz-BFE and DIBP-Bz-CBE matrices obtained are ranged between 141 and 148 respectively and the values of percentage moisture absorption are found to be in the range between 35 0.1% and 0.25% respectively. The DIBP-Bz-BFE and DIBP-Bz-CBE matrices developed in the present invention is considered as cutting- edge concept in the field of diimidazole cored benzoxazine resin technology suitable for microelectronics insulation applications."
Disclaimer: Curated by HT Syndication.
