MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202441021095 A) filed by Hindustan Petroleum Corporation Limited, Bengaluru, Karnataka, on March 20, 2024, for 'process for the preparation of hot melt adhesives from hydrocarbon resins.'
Inventor(s) include Samarth, Nikesh Bhashkarrao; Talukdar, Monikangkana; Rao, Pedada Srinivasa; Patil, Yogesh Popatrao; Chelliahn, Bennet; and Narasimha, Sheshachala Srinivasa.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a hot melt adhesive (HMA) compositions based on C5 aliphatic and dicyclopentadiene (DCPD) resin hydrocarbon resin with polar and non-polar ethylene copolymers. The present invention also relates to a method of preparation of hot melt adhesives from polar and non-polar ethylene copolymers with hydrocarbon resins, hydrocarbon wax and additives, where all were blended, and extruded. The hot melt adhesives prepared using dicyclopentadiene resin showed better mechanical properties, adhesion when tested against 3ply cardboards, shear adhesion failure temp at room temperature, and subzero temperatures."
Disclaimer: Curated by HT Syndication.
