MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202517096090 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on Oct. 6, for 'printed circuit board structure accommodating thermal interface material, and electronic device comprising same.'
Inventor(s) include Kim, Joohan; Cho, Yonglak; and Park, Min.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "A printed circuit board structure (200) according to an embodiment may comprise: a first printed circuit board (210); an interposer (230); a second printed circuit board (220); and a mounting layer (241) having a base hole connected to the second printed circuit board, a support layer (242) provided on the opposite side of the mounting layer with respect to the second printed circuit board, and a visible layer (243) connected to the support layer and having a material having transparency."
The patent application was internationally filed on Apr. 24, 2024, under International application No.PCT/KR2024/005494.
Disclaimer: Curated by HT Syndication.
