MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517047350 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on May 16, for 'printed circuit board including fixing part and electronic device comprising same.'
Inventor(s) include Kim, Bongchan; Jung, Hwajoong; Kim, Taehwan; Park, Jaehyoung; Byon, Kwangseok; and Jo, Jiyeon.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "An electronic device according to an embodiment of the present disclosure may comprise: a drive unit which includes a camera lens; a housing in which the drive unit is disposed and which encompasses the drive unit; and a printed circuit board which is disposed in at least a portion of the housing and the drive unit, wherein: the printed circuit board comprises a sensor part, a fixing part which is coupled to the housing, a connection part which extends while connecting the fixing part and the sensor part to each other, and a flexible part which surrounds at least a portion of the sensor part and is connected to the sensor part and the fixing part; and the connection part is severed when the fixing part is coupled to the housing."
The patent application was internationally filed on Oct. 16, 2023, under International application No.PCT/KR2023/015938.
Disclaimer: Curated by HT Syndication.
