MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202647043615 A) filed by Henkel Ag & Co. Kgaa, Dusseldorf, Germany, on April 6, for 'pressure sensitive adhesive composition.'
Inventor(s) include Kasper, Dirk; Lanova, Barbora; and Brammertz, Benjamin.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "The present invention refers to a pressure sensitive adhesive composition, the use of said composition in re-closable packaging units, an article comprising the pressure sensitive adhesive composition and a method for manufacturing said article."
The patent application was internationally filed on Sept. 02, 2024, under International application No.PCT/EP2024/074452.
Disclaimer: Curated by HT Syndication.
