MUMBAI, India, May 29 -- Intellectual Property India has published a patent application (202631043272 A) filed by Narula Institute Of Technology, Kolkata, West Bengal, on April 4, for 'pre-backfilling smart joint integrity verification device for pipelines.'
Inventor(s) include Mr. Dipan Paul; Mr. Apurba Das; Ms. Anasuya Mondal; Mr. Sabir Ali; and Dr. Shubhendu Banerjee.
The application for the patent was published on May 29, under issue no. 22/2026.
According to the abstract released by the Intellectual Property India: "A portable, non-destructive smart device and corresponding method for verifying the integrity of pipeline joints immediately after assembly and before backfilling is disclosed. The device comprises a temporary split-style enclosure (103) that wraps around the pipeline joint and creates an isolated test chamber using elastomeric or inflatable sealing rings (108, 108a). A micro-pump applies controlled air pressure or vacuum inside the chamber. A multi-sensor suite-comprising pressure sensors (106a/b), acoustic emission sensor (106c), moisture sensor, and ultrasonic sensor (106d)-simultaneously monitors the joint condition in real time. An embedded microcontroller processes sensor data using analytical algorithms and generates a PASS/FAIL result or a quantitative Joint Integrity Index (JII). Results are displayed on a local LCD interface (110) and can be transmitted wirelessly (114) to a management system. The invention enables localized quality assurance, prevents buried failures, and improves the service life of pipeline infrastructure."
Disclaimer: Curated by HT Syndication.
