Intellectual Property India Publishes Patent Application for 'Polypropylene Blister Packaging' Filed by Amcor Flexibles North America, Inc.

MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517046974 A) filed by Amcor Flexibles North America, Inc., Neenah, U.S.A., on May 15, for 'polypropylene blister packaging.'

Inventor(s) include Theobald, Tyler J.; Priscal, Michael D.; Nelson, Kevin P; and Liu, Yuan.

The application for the patent was published on June 6, under issue no. 23/2025.

According to the abstract released by the Intellectual Property India: "A system for forming a blister package includes a thermoformable film and a lidding film. The thermoformable film has a thermoformable film exterior layer and a thermoformable film interior layer. The thermoformable film exterior layer includes at least 50% by weight polypropylene. The thermoformable film interior layer includes at least 50% by weight polypropylene and (a) a tackifier and/or (b) a cyclic olefin copolymer. The lidding film includes a lidding film exterior layer, a seal layer, and a lidding film interior layer between the lidding film exterior layer and the seal layer. The lidding film exterior layer includes at least 50% polypropylene. The lidding film interior layer includes at least 50% polypropylene and a tackifier. The seal layer includes a polyolefin plastomer."

The patent application was internationally filed on Nov. 08, 2022, under International application No.PCT/US2022/049219.

Disclaimer: Curated by HT Syndication.