MUMBAI, India, Jan. 2 -- Intellectual Property India has published a patent application (202541124068 A) filed by B V Raju Institute Of Technology; Venkateshkumar R; P Senthil Kumar; and Jai Urubindu, Narsapur, Telangana, on Dec. 9, 2025, for 'polycarbonate toughened epoxy composite reinforced with high density polyethylene (hdpe) fibers for enhanced mechanical performance.'
Inventor(s) include B V Raju Institute Technology; Venkateshkumar R; P Senthil Kumar; and Jai Urubindu.
The application for the patent was published on Jan. 2, under issue no. 01/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to the development of a polycarbonate toughened epoxy composite reinforced with High Density Polyethylene (HDPE) fibers to enhance its mechanical and environmental performance. Polymer composites are increasingly utilized in engineering applications due to their superior strength-to-weight ratio, corrosion resistance, and manufacturability. However, conventional epoxy matrices are brittle and exhibit limited strain capability. In this invention, polycarbonate is incorporated into epoxy resin to improve toughness, while HDPE fibers are uniformly dispersed within the matrix to further enhance tensile strength, impact resistance, and crack-arresting behavior. HDPE fibers, being lightweight synthetic fibers with density between 0.93-0.97 g/cm, provide high molecular stability, lower branching, and strong intermolecular bonding, enabling improved dimensional stability and thermal endurance. Additionally, the composite exhibits excellent waterproofing characteristics and chemical resistance, allowing for durable performance in various environmental conditions. The resulting composite material is cost-effective, lightweight, and suitable for broad industrial applications including automotive components, packaging materials, and structural parts. This invention provides a promising alternative to conventional epoxy-based composites for improved load-bearing applications."
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