MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202517093227 A) filed by Ube Corporation, Yamaguchi, Japan, on Sept. 29, for 'polyamide resin composition, film and film laminate comprising same, and pellet mixture.'
Inventor(s) include Fujino Hiroshi; Ono Keitarou; Hanaoka Yasunari; and Yamashita Atsushi.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "Provided are: a polyamide resin composition, which can provide a film that does not have poor appearance arising from film gel and has excellent transparency, mechanical strength, and pinhole resistance and which makes material recycling possible; and a film and a film laminate that utilize the polyamide resin composition. The polyamide resin composition contains, based on 100 mass% of the polyamide resin composition, 88-99 mass% of an aliphatic polyamide resin (A), 1-5 mass% of an ethylene having a functional group/C3 to 8 alpha-olefin copolymer (B), and 0-9 mass% of other components (C). The component (A) has a ratio of the number of methylene groups to the number of amide groups of 3-11 and contains 1-50 mass% of an aliphatic homopolyamide (A-1) and 50-99 mass% of an aliphatic copolymerized polyamide (A-2) with respect to 100 mass% of the component (A). The DSC curve of the resin composition has a melting peak at 150 to 205 C. The number average molecular weight Mn of the resin composition is 50,000 to 60,000. Recycling the polyamide resin composition of the present invention or films using the same can contribute to SDGs (Sustainable Development Goals) 13 and 14."
The patent application was internationally filed on Mar. 08, 2024, under International application No.PCT/JP2024/009054.
Disclaimer: Curated by HT Syndication.
