MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202617011443 A) filed by Ems-Chemie Ag, Domat/Ems, Switzerland, on Feb. 3, for 'polyamide moulding compound for producing components with a high weld line strength.'
Inventor(s) include Harder, Philipp; and Beck, Ralf.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "The invention relates to a thermoplastic polyamide moulding compound consisting of the following components: (A) 30 to 74.5 wt.% of at least one partially crystalline, partially aromatic copolyamide 6T/Z with a melting point of at least 270 C, wherein the polyamide unit Z is formed from at least one lactam or an aminocarboxylic acid and/or from polyamide units different from 6T consisting of at least one diamine and at least one dicarboxylic acid, wherein the 6T content in 6T/Z is more than 50 mol-%, based on the molar proportions of all polyamide units; (B) 25 to 50 wt.% glass fibres with an average diameter of 5 to 8 m, wherein the glass fibres are coated with a sizing composition containing (b1) at least one silane compound, (b2) at least one polymer or copolymer based on unsaturated carboxylic acids and/or unsaturated carboxylic acid anhydrides, and (b3) an epoxy resin, a polyurethane resin, or a polyamide resin, with the proviso that if component (b3) is a system containing carboxylic acid and/or anhydride, the sizing composition may also omit component (b2); (C) 0.5 to 8 wt.% impact modifier; (E) 0 to 20 wt.% amorphous, partially aromatic polyamide; (D) 0 to 10 wt.% additives other than (A)-(C) and (E); and wherein the sum of components (A) to (E) totals 100 wt.% of the polyamide moulding compound."
The patent application was internationally filed on Aug. 23, 2024, under International application No.PCT/EP2024/073654.
Disclaimer: Curated by HT Syndication.
