MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514080790 A) filed by Pi Advanced Materials Co. Ltd., Chungcheongbuk, Republic of Korea, on Aug. 26, 2025, for 'polyamic acid composition with improved adhesion and polyimide cured product comprising the same.'
Inventor(s) include Moon, Gyeong Min; Yoo, Cheol Hun; We, Jung Hoon; Park, Se Joo; and Lee, Ik Sang.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The present invention provides a polyamic acid composition comprising a dianhydride monomer and a diamine monomer as polymerization units, wherein the diamine monomer comprises a first diamine monomer, a second diamine monomer, and a third diamine monomer, the second diamine monomer is a flexible diamine monomer having three or more benzene rings, and the third diamine monomer is represented by Chemical Formula 1. The polyamic acid composition of the present disclosure may have excellent adhesion and adherence to wires such as copper, and thus may have excellent usability as an insulating coating material for an electric wire, etc."
Disclaimer: Curated by HT Syndication.
