MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202411004741 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Jan. 23, 2024, for 'plant budding device.'
Inventor(s) include Reshu Rajput.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A plant budding device, comprising a pair of semi-circular bodies 1 constructed with a set of curved-shaped plates 2, a camera 3 installed with one of bodies 1 via a link 4 for capturing multiple images of stem, multiple motorized hinges 5 configured between plates 2 to tilt plates 2 towards/away from each other, a set of electromagnets 6 configured with each of bodies 1 for adhering bodies 1 with each other, multiple iris pores 7 for allowing proper ventilation to soil, a set of motorized iris lid 8 for allowing passing of sunlight within bodies 1, an electronic nozzle 9 configured with each of bodies 1 for dispensing water on soil, a humidity sensor positioned on one of members 12 detect humidity level in surroundings, a Peltier unit configured within each of members 12 for cooling coolant liquid and an SPR sensor detect any insect/pest in soil."
Disclaimer: Curated by HT Syndication.
