MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514066018 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Shenzhen, China, on July 10, 2025, for 'photoelectric packaging structure, manufacturing method, and camera module.'
Inventor(s) include Hung-Ta Li; Hsin-Yen Hsu; Tzu-Li Feng; and Yi-Mou Huang.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "A photoelectric packaging structure, manufacturing method, and camera module are provided. The structure includes a substrate module, a photosensitive chip, and a plastic packaging module. The substrate module includes a glass substrate and a first conductive structure with a first conductive pad. The photosensitive chip and the plastic packaging module are located on the substrate module. The plastic packaging module includes a packaging body and a second conductive structure. The second conductive structure includes a first and a second conductive channels, a second and a third conductive pads. The first and the second conductive channels are located in the packaging body. The first conductive channel is connected to the first and the second conductive pads. The second conductive channel is connected to the photosensitive chip and the third conductive pad. The second conductive pad is connected to the third conductive pad, thereby connecting the photosensitive chip to the substrate module."
Disclaimer: Curated by HT Syndication.
