MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202517128572 A) filed by Bae Systems Information And Electronic Systems Integration Inc., New Hampshire, U.S.A., on Dec. 18, 2025, for 'patterning using monomer based sacrificial material liftoff.'

Inventor(s) include Wyckoff, Nathaniel P; Terry, Benjamin; and Warren, Alexander S.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "A method includes forming a plurality of islands of first material on a plurality of first sections of a layer. A plurality of second sections of the layer are not covered by the first material. The method further includes depositing a second material on (i) the islands of first material and (ii) the second sections of the layer that are not covered by the islands of first material. The method further includes evaporating and/or sublimating the islands of first material and removing remnants of the second material that were on the islands of the first material. In an example, the second material remains on the second sections of the layer, to thereby form a pattern of the second material on the layer. In an example, the first material is a monomer, and the second material is a conductor or a dielectric or a semiconductor."

The patent application was internationally filed on May 29, 2024, under International application No.PCT/US2024/031385.

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