MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202647041922 A) filed by Applied Materials, Inc., Santa Clara, U.S.A., on April 1, for 'passive lift pin assembly.'
Inventor(s) include Brezoczky, Thomas; Savandaiah, Kirankumar Neelasandra; Manivannan, Srinivasan; and Rengaraj, Arun.
The application for the patent was published on April 10, under issue no. 15/2026.
According to the abstract released by the Intellectual Property India: "A substrate support assembly includes a substrate support that is moveable between a raised position, a lowered position below the raised position, and an intermediate position between the raised and lowered positions. A lift pin is disposed in a hole through the substrate support, and is movable vertically with respect to the substrate support. In use, the substrate support assembly transitions between first and second configurations. In the first configuration, the substrate support and the lift pin are coupled such that the lift pin and the substrate support move simultaneously while the substrate support moves between the lowered position and the intermediate position. In the second configuration, the substrate support and the lift pin are decoupled such that the lift pin remains stationary while the substrate support moves between the intermediate position and the raised position."
The patent application was internationally filed on July 24, 2024, under International application No.PCT/US2024/039230.
Disclaimer: Curated by HT Syndication.
