MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202617014193 A) filed by Owens Corning Intellectual Capital, Llc, Toledo, U.S.A., on Feb. 10, for 'packaging system.'
Inventor(s) include Brandt, Luc; Dufresne, Elizabeth A; Graham, John William; Potrony, Francisco Fernndez; and Obrin, III, Steve John.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "A package includes discrete units of a fibrous material (e.g., fiberglass rovings, carbon tows) that are positioned in multiple layers on a pallet, with each layer of the fibrous material units having a separator plate supported over it. According to this configuration, the package is able to deliver the fibrous material from each fibrous material unit at the same time. The fibrous material from the units on the pallet can be delivered to one or more fiber-requiring processes, such as a knitting process, a weaving process, a winding process, a chopping process, a pultrusion process, etc."
The patent application was internationally filed on Aug. 21, 2024, under International application No.PCT/US2024/043195.
Disclaimer: Curated by HT Syndication.
