MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202514002979 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Shenzhen, China, on Jan. 13, for 'packaging structure and preparing method thereof.'
Inventor(s) include Hung-Ta Li.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A packaging structure and a preparing method are provided. The structure includes a first packaging body, a second packaging body, a first component embedded in the first packaging body, and a second component embedded in the second packaging body. The first packaging body includes a first surface and a second surface. The first packaging body includes a first conductive structure partially exposed from the second surface, and the first conductive structure is electrically connected to the first component. The second packaging body is formed on the first packaging body and includes a third surface and a fourth surface. The second packaging body includes a second conductive structure partially exposed from the third and fourth surfaces. The second conductive structure exposed from the third surface is electrically connected to the exposed first conductive structure. The second conductive structure exposed from the fourth surface is electrically connected to the second component."
Disclaimer: Curated by HT Syndication.
