Intellectual Property India Publishes Patent Application for 'Organic Binder For Molds, And Molding Sand Composition And Mold Produced Using Same' Filed by Asahi Yukizai Corporation

MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517059921 A) filed by Asahi Yukizai Corporation, Miyazaki, Japan, on June 23, for 'organic binder for molds, and molding sand composition and mold produced using same.'

Inventor(s) include Mori, Keiichi; and Maeda, Hironobu.

The application for the patent was published on July 4, under issue no. 27/2025.

According to the abstract released by the Intellectual Property India: "Provided is an organic binder for molds, which has an excellent curing speed during molding and that yields a mold exhibiting excellent strength. The organic binder for molds is prepared using: a lignin-modified phenolic resin that serves as a resin binding component; and triethylenediamine. The lignin-modified phenolic resin is preferably a novolac-type phenolic resin modified with at least one component selected from kraft lignin, glycol lignin and lignin acetate."

The patent application was internationally filed on Nov. 20, 2023, under International application No.PCT/JP2023/041583.

Disclaimer: Curated by HT Syndication.