MUMBAI, India, Nov. 21 -- Intellectual Property India has published a patent application (202517097573 A) filed by Namics Corporation, Niigata, Japan, on Oct. 9, for 'novel acrylamide, composition containing same, curable composition, adhesive, sealing material, cured product, semiconductor device, and electronic component.'
Inventor(s) include Sato Ayako; and Iwaya Kazuki.
The application for the patent was published on Nov. 21, under issue no. 47/2025.
According to the abstract released by the Intellectual Property India: "The present invention addresses the problem of providing: a novel substance capable of solving the problem of conventional bismaleimides having a dimer acid skeleton; a curable composition, adhesive, or sealing material containing same and having excellent photo-curability and adhesive strength; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product. Provided are: a dimer acid-modified acrylamide; a composition mainly containing the dimer acid-modified acrylamide; a curable composition, adhesive, or sealing material containing the dimer acid-modified acrylamide and a radical polymerization initiator; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product."
The patent application was internationally filed on Apr. 01, 2024, under International application No.PCT/JP2024/013411.
Disclaimer: Curated by HT Syndication.
