MUMBAI, India, Aug. 8 -- Intellectual Property India has published a patent application (202517036180 A) filed by Borealis Ag, Vienna, on April 15, for 'multimodal ethylene copolymer composition and films comprising the same.'
Inventor(s) include Buryak Andrey; and Sumerin Victor.
The application for the patent was published on Aug. 8, under issue no. 32/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a multimodal ethylene copolymer composition comprising 5 to 25 wt.% relative to the total weight of the multimodal ethylene copolymer composition of a first ethylene copolymer (A1) comprising a copolymer of ethylene and at least a first ?? olefin comonomer with a density as determined according to ISO 1183 187 ranging from 920 to 960 kg/m??; to 35 wt.% relative to the total weight of the multimodal ethylene copolymer composition of a second ethylene copolymer (A2) comprising a copolymer of ethylene and at least the first ?? olefin comonomer with a density as determined according to ISO 1183 187 ranging from 920 to 960 kg/m??; 40 to 80 wt.% relative to the total weight of the multimodal ethylene copolymer composition of a third ethylene copolymer (B) comprising a copolymer of ethylene and at least the first and a second ?? olefin comonomer; wherein said third ethylene copolymer (B) has a higher weight average molecular weight (MW) than said first ethylene copolymer (A1) and said second ethylene copolymer (A2); wherein the composition has a density as determined according to ISO 1183 187 in the range of from 915 to 930 kg/m??; an MFR5 determined according to ISO1133 in a range of from 0.5 to 5.0 g/10min; and wherein a content of the second ?? olefin comonomer in said third ethylene copolymer (B) is in a range of from 15 to 85 % based on the total comonomer content on mol basis in said third ethylene copolymer (B). A process for preparing the composition and films comprising the composition are also disclosed."
The patent application was internationally filed on Sept. 29, 2023, under International application No.PCT/EP2023/077142.
Disclaimer: Curated by HT Syndication.
