Intellectual Property India Publishes Patent Application for 'Multilayer Metallized Paper-Based Packaging Material' Filed by Societe Des Produits Nestle S. A.

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517032649 A) filed by Societe Des Produits Nestle S. A., Vevey, Switzerland, on April 2, for 'multilayer metallized paper-based packaging material.'

Inventor(s) include Mora, Federico; Darra, Matteo Riccardo; and Galaffu, Nicola.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to an oxygen-barrier substrate comprising or consisting of a graft copolymer comprising a vinyl alcohol polymer backbone and polypeptide branches. The present invention also relates to a packaging material comprising at least one oxygen-barrier layer comprising or consisting of a graft copolymer comprising a vinyl alcohol polymer backbone and polypeptide branches, in particular a multi-layer metallized paper-based packaging material."

The patent application was internationally filed on Nov. 20, 2023, under International application No.PCT/EP2023/082321.

Disclaimer: Curated by HT Syndication.