MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202537071164 A) filed by Zephyros, Inc., Romeo, U.S.A., on July 26, for 'multilayer composite heat shield.'

Inventor(s) include Vogel, Frederic; Klein, Guillaume; and Walker, Jason.

The application for the patent was published on Sept. 26, under issue no. 39/2025.

According to the abstract released by the Intellectual Property India: "A multilayer structure comprising a first layer comprised of a resin and a fiber; a second layer comprised of a foam; and a third layer comprised of a heat reflecting material, wherein the first layer is bonded to the second layer and the second layer is bonded to the third layer."

The patent application was internationally filed on Feb. 14, 2024, under International application No.PCT/US2024/015842.

Disclaimer: Curated by HT Syndication.