MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202517067553 A) filed by Abu Dhabi Polymers Co. Ltd. (BOROUGE) - Sole Proprietorship L. L. C; and Borealis Ag, Abu Dhabi, U.A.E., on July 15, for 'multilayer collation shrink film.'
Inventor(s) include Kumar Das, Subrata; Defoer, Johan; and De Santis, Felice.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a multilayer collation shrink film, comprising at least three layers, wherein core layer (B) comprises at least (B1) recycled LDPE having a strain hardening factor of from 1.5 to 5.0 when measured at 180 C, at a strain rate of 3.0 s-1 and a Hencky strain of 2.5 in an amount of at least 50 wt%, based on the total weight of the core layer (B), and (B2) a specific linear copolymer of ethylene. The invention further refers to a method for manufacturing this multilayer film and its use in the field of secondary packaging."
The patent application was internationally filed on Dec. 18, 2023, under International application No.PCT/EP2023/086318.
Disclaimer: Curated by HT Syndication.
