MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517051329 A) filed by Murata Manufacturing Co. Ltd., Kyoto, Japan, on May 28, for 'multilayer ceramic electronic component.'
Inventor(s) include Miyauchi Satoshi.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "Provided is a layered ceramic electronic component with which peeling at an interface between a metal terminal and an exterior material can be suppressed and a drop in reliability of the electronic component can be prevented. A layered ceramic capacitor 1 comprises: a layered ceramic capacitor body 2; metal terminals (100A, 100B) connecting to external electrodes (40A, 40B) via a bonding material 5; and an exterior material 3 covering the layered ceramic capacitor body 2 etc. The metal terminals (100A, 100B) have bonding surfaces (110A1, 110B1) that bond with the bonding material 5, and contact surfaces (CS1, CS2) that contact the exterior material 3. The contact surfaces (CS1, CS2) have outermost surface plating films (100Ab2, 100Bb2) on at least a portion thereof, and exposed surfaces (E1a, E1b, E1c, E2a, E2b, E2c) on which are formed a plurality of protrusions that are made of a metal differing from a metal forming the outermost surface plating films (100Ab2, 100Bb2), and that have an undercut shape."
The patent application was internationally filed on Nov. 24, 2023, under International application No.PCT/JP2023/042188.
Disclaimer: Curated by HT Syndication.
