MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202647025526 A) filed by Sumitomo Electric Industries, Ltd., Osaka, Japan, on March 4, for 'multicore cable.'
Inventor(s) include Hirayama Kaede.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "This multicore cable has: two insulated wires each having a conductor and an insulating layer; and a sheath that collectively covers the two insulated wires. The insulating layer is formed from an ethylene-vinyl acetate copolymer resin. The sheath is formed from an ethylene-ethyl acrylate copolymer resin, and the pulling force of the insulated wires from the sheath is between 5 N/30 mm and 35 N/30 mm, inclusive."
The patent application was internationally filed on Sept. 04, 2024, under International application No.PCT/JP2024/031774.
Disclaimer: Curated by HT Syndication.
