Intellectual Property India Publishes Patent Application for 'Multi-Stack Compute Chip And Memory Architecture' Filed by Advanced Micro Devices, Inc.

MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202517075812 A) filed by Advanced Micro Devices, Inc., Santa Clara, U.S.A., on Aug. 8, for 'multi-stack compute chip and memory architecture.'

Inventor(s) include Ignatowski, Michael; Schulte, Michael J.; and Loh, Gabriel Hsiuwei.

The application for the patent was published on Aug. 29, under issue no. 35/2025.

According to the abstract released by the Intellectual Property India: "Multi-stack compute chip and memory architecture is described. In accordance with the described techniques, a package includes a plurality of computing stacks, and each computing stack includes at least one compute chip and a memory. The package also includes one or more interconnects that couple the computing stacks to at least one other computing stack for sharing the memory in a coherent fashion across the plurality of computing stacks."

The patent application was internationally filed on Dec. 21, 2023, under International application No.PCT/US2023/085320.

Disclaimer: Curated by HT Syndication.