MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202247061469 A) filed by Osaka Gas Co. Ltd.; and Asahi Kohsan Corporation, Osaka, Japan, on Oct. 28, 2022, for 'mounting method and removal method for heat insulation structure.'
Inventor(s) include Sumida Koichi; Chiba Hideyuki; and Nakamura Hideo.
The application for the patent was published on Sept. 5, under issue no. 36/2025.
According to the abstract released by the Intellectual Property India: "Provided is a mounting method for a heat insulation structure capable of favorably insulating an object to be insulated and facilitating the work of mounting a heat insulation member. A recessed groove part (8) recessed in a circumferential direction from an end surface of a heat insulation member (P), facing another heat insulation member (P) adjacent to an object (1) to be insulated in a circumferential direction, is previously formed in the facing end surface. A connection member (7) that is long along the longitudinal direction of the heat insulation member (P) is previously formed while including, along a circumferential direction, a pair of engagement parts (7a) which engage with the recessed groove part (8) of the heat insulation member (P) adjacent in the circumferential direction. When the heat insulation member (P) is mounted on the object (1) to be insulated, an arrangement step for arranging the heat insulation member (P) adjacent in the circumferential direction on an outer peripheral part of the object (1) to be insulated in a state in which the facing end surfaces abut each other, and an insertion step for inserting the connection member (7) into the recessed groove part (8) of the adjacent heat insulation member (P) are sequentially performed."
The patent application was internationally filed on Mar. 31, 2020, under International application No.PCT/JP2020/014818.
Disclaimer: Curated by HT Syndication.
