MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202647040971 A) filed by Advanced Micro Devices, Inc., Santa Clara, U.S.A., on March 31, for 'molded core substrate for embedding components.'
Inventor(s) include Kulkarni, Deepak Vasant; Boyapati, Sri Ranga Sai; and Sidhu, Rajen Singh.
The application for the patent was published on April 10, under issue no. 15/2026.
According to the abstract released by the Intellectual Property India: "Active and passive electronic components are placed on a substrate and encapsulated with mold material to produce a molded core substrate for fabricating a hybrid integrated circuit (IC) device. A carrier has a release film laminated to a face thereof. A seed layer of copper is added over the release film and fiducials are plated onto the copper seed layer for component placement using alignment marks on the fiducials. Mold material is applied to the encapsulation layer and around and over the components. Mold material is ground planar with component tops. The carrier and release film are removed, leaving the copper seed layer exposed, which is etched to a pattern. Holes are formed in the mold material and then surfaces thereof are copper plated. A multilayer dielectric film is laminated over copper plating. Vias are formed in the multilayer dielectric film for connections to components."
The patent application was internationally filed on June 10, 2024, under International application No.PCT/US2024/033227.
Disclaimer: Curated by HT Syndication.
