MUMBAI, India, Jan. 8 -- Intellectual Property India has published a patent application (202511104549 A) filed by Ajay Kumar Garg Engineering College, Ghaziabad, Uttar Pradesh, on Oct. 29, 2025, for 'modular thermal management system for high-performance servers.'
Inventor(s) include Dr. Rahul Sharma; Ms. Shikha Agarwal; and Swarnima Gupta.
The application for the patent was published on Dec. 12, under issue no. 50/2025.
According to the abstract released by the Intellectual Property India: "A modular cooling unit (100) for high-performance computing clusters is disclosed. Said unit (100) comprises a housing (102) including a module bay (104). A swappable cooling module (106) is received in said module bay (104) and retained by a lock (108). A fan array (110) includes a disc (112) carrying a plurality of blades (114) driven by an actuator unit (116) to direct airflow across server nodes. A heat pipe network (118) coupled to said swappable cooling module (106) is regulated by a valve (120) to control flow of coolant. A rack-integrated cooling channel (122) formed in said housing (102) routes said airflow to selected regions of the computing cluster. Said unit (100) enables modular replacement of cooling components, improves adaptability to varying workloads, reduces energy consumption by dynamic airflow control, and enhances thermal management efficiency across high-performance computing environments."
Disclaimer: Curated by HT Syndication.
