Intellectual Property India Publishes Patent Application for 'Modular Manifold For Use With A Microfluidics Chip And Having Two-Way And Three-Way Plate Manifolds And Method Of Making The Same' Filed by Asco, L. P.

MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517057281 A) filed by Asco, L. P., Florham Park, U.S.A., on June 14, for 'modular manifold for use with a microfluidics chip and having two-way and three-way plate manifolds and method of making the same.'

Inventor(s) include Hoskins, Matthew, T.

The application for the patent was published on July 4, under issue no. 27/2025.

According to the abstract released by the Intellectual Property India: "A modular manifold having two-way and three-way plate manifolds and a method of making the same. The modular manifold is intended to replace the large array of valves (interconnected with tubing) typically needed in medical, industrial, or analytical applications, thereby reducing the required footprint. The modular manifold includes one or more flow manipulation gaskets having configurable areas that can be configured to selectively manipulate fluid flowing therethrough in a desired manner."

The patent application was internationally filed on Nov. 21, 2023, under International application No.PCT/US2023/080806.

Disclaimer: Curated by HT Syndication.