MUMBAI, India, April 11 -- Intellectual Property India has published a patent application (202517026888 A) filed by Staubli Electrical Connectors Ag, Allschwil, Switzerland, on March 24, for 'modular electrical connector assembly.'
Inventor(s) include Carver, Dustin Delmar Reede; Katz, Max; Maurer, Grayson; Mills, Brian Wade; Wade, Lee Michael; and Howard, Andrew.
The application for the patent was published on April 11, under issue no. 15/2025.
According to the abstract released by the Intellectual Property India: "Modular electrical connector assembly comprises a socket carrier element (1) having a bearing section (2), a mating structure (3) and a carrier structure (4) to carry at least one electrical socket element (5); a pin carrier element (6) having a bearing section (7), a mating structure (8) and a carrier structure (9) to carry at least one electrical pin element (10); a socket housing (11) with a receiving section (12) to which the socket carrier element (1) is mounted by means of the bearing section (2) and with a housing section (13); and a pin housing (14) with a receiving section (15) to which the pin carrier element (6) is mounted by means of the bearing section (2) and with a housing section (16), wherein the mating structure (3) of the socket carrier element (1) mechanically mates with the mating structure (8) of the pin carrier element (6), wherein the at least one electrical socket element (5) and the at least one electrical pin element (10) are arranged such that when the socket carrier element (1) is mated with the pin carrier element (6) an electrical contact is provided between the at least one electrical socket element (5) and the at least one electrical pin element (10), and wherein the bearing section (2) of the socket carrier element (1) is identical to the bearing section (7) of the pin carrier element (6) and the receiving section (12) of the socket housing (11) is identical to the receiving section (15) of the pin housing (14)."
The patent application was internationally filed on Sept. 05, 2023, under International application No.PCT/EP2023/074231.
Disclaimer: Curated by HT Syndication.
