MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511123078 A) filed by K. R. Mangalam University, Gurugram, Haryana, on Dec. 6, 2025, for 'method for rapid thermal cycling in precision manufacturing applications.'
Inventor(s) include Dr. Kaushal Kumar; and Dr. Manish Kumar.
The application for the patent was published on Jan. 23, under issue no. 04/2026.
According to the abstract released by the Intellectual Property India: "The present invention provides a method for rapid thermal cycling in precision manufacturing applications by integrating localized thermal actuation, high-speed cooling mechanisms, distributed temperature sensing, and predictive thermal-control logic. The method establishes a dynamically responsive thermal-control zone around a component and regulates heating and cooling transitions through real-time sensor feedback and material-aware predictive models. Rapid temperature ramps are achieved while maintaining uniform thermal gradients, reducing thermal lag, preventing overshoot, and minimizing thermally induced defects. The system adapts to different materials, geometries, and process workflows, enabling improved dimensional accuracy, structural stability, and manufacturing throughput. The method is compatible with machining, additive manufacturing, semiconductor processing, mold fabrication, and other precision-production environments that require accelerated and controlled thermal transitions."
Disclaimer: Curated by HT Syndication.
