MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517041795 A) filed by Cnbm Research Institute For Advanced Glass Materials Group Co. Ltd., Anhui, China, on April 30, for 'method for preparing small-width linear structure on upper surface of target layer of layer stack and application thereof.'
Inventor(s) include Shen, Yilei; and Stoelzel, Marko.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "The present invention discloses a method for preparing a small-width linear structure on the upper surface of a target layer of a layer stack and application thereof. The method for preparing a linear structure includes the steps of: acquiring the preset positions of both sides of the linear structure on the upper surface of the target layer, which are denoted as a first side position and a second side position; forming a protruding line at at least one side position by producing a plurality of protrusions at intervals along the side length direction at at least one of the first side position and the second side position of the upper surface of the target layer; and applying a liquid-type linear structure material to one side of the protruding line for deposition to obtain a linear structure confined to one side of the protruding line."
The patent application was internationally filed on Nov. 24, 2023, under International application No.PCT/CN2023/134042.
Disclaimer: Curated by HT Syndication.
