MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202411072595 A) filed by Birla Institute Of Technology & Science, Pilani, Rajasthan, on Sept. 25, 2024, for 'method for preparing mxene composition and fabricating flexible-rigid printed circuit boards.'
Inventor(s) include Sahatiya, Parikshit; Trivedi, Nandini A.; and Nandi, Sourav.
The application for the patent was published on April 10, under issue no. 15/2026.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to a method (100) for preparing MXene compositions and fabricating flexible-rigid printed circuit boards (PCBs). The method includes preparing MXene ink by utilizing a minimally intensive layer delamination (MILD) technique to etch MXene, followed by dispersing the resulting MXene layers in an aqueous solution with deionized (DI) water to form a stable colloidal suspension. Bath sonication is applied to ensure uniform dispersion of the MXene layers. The prepared MXene ink is then printed onto flexible substrates, such as polyethylene terephthalate (PET), using an extrusion-based direct ink writing (DIW) technique. This method offers a scalable and cost-effective approach to producing flexible PCBs with high electrical conductivity and mechanical properties, suitable for a range of electronic applications. The process operates at room temperature, eliminating need for a cleanroom environment, and supports a wide range of ink viscosities and substrate materials, enhancing flexibility and adaptability in PCB manufacturing."
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