MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511123081 A) filed by K. R. Mangalam University, Gurugram, Haryana, on Dec. 6, 2025, for 'method for multi-phase cooling of high-density mechanical assemblies.'
Inventor(s) include Dr. Kaushal Kumar; and Dr. Prabhakar Bhandari.
The application for the patent was published on Jan. 23, under issue no. 04/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a method for multi-phase cooling of high-density mechanical assemblies through a thermally adaptive sequence of fluid-state transitions. A cooling medium circulates through a network of thermally coupled channels integrated within the assembly, where it absorbs heat and transitions from a liquid phase to a vapor phase. The resulting vapor is directed through vapor-flow pathways to a condensing region, where it releases latent heat and returns to the liquid phase. The liquid is transported back to the thermal zones for repeated cooling. The method enables efficient dissipation of concentrated thermal loads, maintains stability under dynamic operating conditions, and supports compact mechanical architectures by utilizing embedded pathways, heat-responsive phase transitions, and multi-directional fluid stability. The approach enhances thermal reliability, energy efficiency, and long-term performance of high-density mechanical systems."
Disclaimer: Curated by HT Syndication.
