MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517051371 A) filed by Corning Incorporated, Corning, U.S.A., on May 28, for 'method for laser drilling syringe bore to eliminate tungsten contamination.'
Inventor(s) include Abramov, Anatoli Anatolyevich; and O'Malley, Connor Thomas.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "Provided are embodiments of a method of forming a syringe barrel. In the method, a bore is drilled through a tip of the syringe barrel with a first laser to provide fluid communication with an interior cavity of the syringe barrel. The interior cavity is defined by a tubular wall of the syringe barrel. A surface of the bore is treated with a second laser to remelt the surface of the bore. The tubular wall and tip are made of a glass material. Advantageously, forming the bore of the syringe barrel using laser drilling and treating avoids tungsten contamination."
The patent application was internationally filed on Nov. 28, 2023, under International application No.PCT/US2023/081231.
Disclaimer: Curated by HT Syndication.