MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511123072 A) filed by K. R. Mangalam University, Gurugram, Haryana, on Dec. 6, 2025, for 'method for hybrid convection-radiation heat dissipation in compact structures.'
Inventor(s) include Dr. Imran Siraj; and Dr. Anshu.
The application for the patent was published on Jan. 23, under issue no. 04/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a method for hybrid convection-radiation heat dissipation in compact structures, designed to address increasing thermal loads in miniaturized electronic, mechanical, and electromechanical systems. The method transfers heat from internal components to dissipative surfaces through thermally conductive pathways and utilizes high-emissivity coatings, engineered surface textures, and geometric airflow-enhancing structures to enable simultaneous radiative and convective heat transfer. The method establishes a self-balancing thermal response in which radiation becomes dominant at higher temperatures and convection becomes more effective during lower thermal states. By supporting heat removal in sealed and semi-sealed environments and accommodating material and geometric variations, the method provides an adaptable, efficient, and passive cooling solution suitable for compact, high-power, and space-constrained applications across diverse industries."
Disclaimer: Curated by HT Syndication.
